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Tuesday, 26 May 2009

Modelling optical performance of devices in conventional CAD packages has proved either impossible or extremely time-consuming. However, managing light and lit appearance are crucial for lighting systems, style signature and human machine interfaces.

OPTIS has announced that its 3D Textures application will soon be available into SPEOS CAA V5 Based, the CATIA V5 integrated version of OPTIS’s SPEOS light simulation software. SPEOS enables engineering designers to model complex integrated mechanical and optical engineering tasks seamlessly within CATIA V5.

Using 3D Textures For SPEOS CAA V5 Based, a designer can easily create tens of millions of modelled points on surfaces, directly inside CATIA V5, in view to manage the way light is propagated and comes to the final user’s eye.

With the integration of LED sources in more and more systems such automotive tail lamps, luminaire design, lit buttons and backlights in electronics including PDAs and mobile phones, it becomes necessary to generate 3D Textures motifs applied on complex compound surfaces.

SPEOS 3D Textures enables a 3D model to include tens of millions of patterns thanks to a memory requirement optimization (150Mb needed for 1 million patterns), a rapid loading time and fast simulation time (16min for 4 million patterns). It also offers fully optimised multithreaded and 64bit operation, which other packages cannot match.

3D Textures For SPEOS CAA V5 Based will offer advanced optical design capabilities, including modelling CAD patterns onto any possible CAD shape and surface and modelling based on mixing diverse materials of construction.

With this unique 3D Textures function, SPEOS CAA V5 Based will enable both improved design functionality and time-saving in challenging applications such as modelling backlit displays, and the latest designs of automotive lights.

The OPTIS Team

Tuesday, 26 May 2009 10:24:26 (Romance Daylight Time, UTC+02:00)  #    Disclaimer  |  Comments [0]  | 

Tuesday, 19 May 2009

This bi-annual event of Creaform on May 20-22 will gather customers and users around 3D scanning and reverse engineering. DS is present with a booth to show how Creaform and DS solutions can work in concert. Creaform is a CAA software partner and specialist VAR in the reverse engineering domain.

#1 Advance your Handyscan 3D scanning skills
#2 Best Practices and Methodology Seminars – Tips & Trick Sessions
#3 Combining a Handyscan 3D scanner with other technology
#4 Ask the Experts
#5 Hands-on sessions
#6 International Knowledge Sharing
#7 Increase your ROI on your Handyscan 3D scanner(s)
#8 Networking
#9 Creaform Software Partners on-site
#10 Beautiful Quebec City
Combine business with pleasure! Visit Quebec City and its historical venues in late spring, one of the most agreeable time of the year, while staying at the renowned and luxurious Fairmont Le Château Frontenac.
Jacques for Creaform
Tuesday, 19 May 2009 17:31:32 (Romance Daylight Time, UTC+02:00)  #    Disclaimer  |  Comments [0]  | 

Friday, 15 May 2009

We are proud to welcome a new Referenced partner on PLM MarketPlace: ELSYS! ELSYS is one of the leaders in electrical harness design and brings a complete suite of solutions in this application domain.

ELSYS comes up with innovative PLM Solutions in Electrical Engineering. That means a radically new way of handling and integrating electrical technology with the design and manufacture of electromechanical products and systems.

Because ELSYS’s solutions (CATELECTRE, SMARTELECTRE, ELECTRE) facilitate collaborative work between electrical and mechanical engineers, they highly improve their efficiency by taking complete charge of all aspects of the diversity and complexity of the systems, from onboard electrical engineering (functions, standards, etc.) and electromechanical engineering (3D routings, segregation, etc.) to project engineering (configuration management, manufacturing documents, etc.).

These solutions bring a high value added in all stages of the design process thanks to a thorough understanding of onboard electrical engineering needs and full allowance for the problems of 3D wiring in both design and manufacturing.

We are very happy to welcome our Belgo/French fellows onboard and hope they will help you to fullfil your needs in terms of electrical harness design.

Anthony and the Elsys team

Friday, 15 May 2009 14:33:36 (Romance Daylight Time, UTC+02:00)  #    Disclaimer  |  Comments [0]  | 

Thursday, 07 May 2009

This year, Dassault Systèmes helds its annual Developper Conference (aka DEVCON) at DS Campus, located in Vélizy-Villacoublay, near Paris in June 23-24, 2009.
With a new concept, this year's conference will be at the heart of the Labs, and be THE place for 3D developers and PLM engineers.

Dassault Systèmes’ DEVCON is a unique opportunity for you to meet DS and Partners’ experts. They will be glad to meet you and share their latest innovation.

DEVCON 2009 main topics will be:
• Fresh news on V6 and a preview of the upcoming release. Be prepared to install, deploy, develop on V6.
• Online strategy, products and services will be at the heart of Devcon09
• Round tables on future tech trends and how the 3D will leverage new devices and mobility.
• New partnership programs and communities
• Testimonials from new customers and partners, in the industries, online communities and serious gaming.

By the way, note that some of PLM MarketPlace partners will be there. Take a moment to meet them and discover the value added by their solutions!

Also, we're sure you'll enjoy an exciting visit in the LIVES!

"Open the door to the world we imagine"... Doesn't it sound familiar? ;-)

If you want to keep in touch with the community, subscribe to the official DS DEVCON Twitter and join the official group on Facebook! stay tuned to get more details in the coming days!

I hope to see you in June @ DS Campus for this exciting event!


Thursday, 07 May 2009 10:28:16 (Romance Daylight Time, UTC+02:00)  #    Disclaimer  |  Comments [0]  | 

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Beyond PLM (Product Lifecycle Management), Dassault Systèmes, the 3D Experience Company, provides business and people with virtual universes to imagine sustainable innovations. 3DSWYM, 3DVIA, CATIA, DELMIA, ENOVIA, EXALEAD, NETVIBES, SIMULIA and SOLIDWORKS are registered trademarks of Dassault Systèmes or its subsidiaries in the US and/or other countries.